DOD Announces $14 Million Agreement With Draper in Support of Computer Chips Advanced Packaging Solutions

 March 2, 2021

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The Department of Defense (DOD) entered into a $14 million agreement with Draper to enhance the U.S.’s ability for volume production of advanced packaging solutions for computer chips embedded within defense systems. 

Draper received a $10 million contract from the Defense Production Act (DPA) Title III office. The company also received a $4 million contract from the DOD Industrial Base Analysis and Sustainment (IBAS) office. Draper intends to expand existing domestic supplier production capabilities to produce three dimensional (3D), ultra-high-density microelectronics modules for use in mission critical applications.  Draper’s integrated ultra-high-density technology is in high-volume production at i3 Microsystems’ fabrication facility in St. Petersburg, Fla.

Access to secure state-of-the-art microelectronics used by military systems like DoD aircraft, ground vehicles and complex weapons systems is critical to ensuring our nation’s technological advantage.